Expansion of the worldwide sales network: new partner in Sweden
In addition to the 15 international Rösler branches, a new partner in Sweden is on board:KMC Ytbehandling AB. The company distributes the 3D post processing solutions of AM Solutions exclusively in the Scandinavian country. This also applies to the distribution of AM Solutions partner products from PostProcess Technologies and GPA Innova.
KMC is a subsidiary of the publicly traded Addtech group. The company, located in Järfälla, has been active in the field of surface treatment for over 30 years and brings a wealth of experience in equipment sales and process development to the table. To date the company has been marketing the solutions of technological and market leaders in the field of mass finishing, shot blasting, balancing and industrial part cleaning
Manuel Laux, Head of AM Solutions, comments: “KMC is a competent and innovative partner with a lot of experience and know-how in the Swedish market. The company is known for its comprehensive expertise in customer support including service. This will allow us to jointly assist the customers with their additive manufacturing needs”.
Daniel Adlers, Managing Director of the KMC Ytbehandling AB adds: „The partnership with AM Solutions allows us to successfully enter a new, rapidly growing market segment and to expand our product range for the future. With this cooperation we can now offer innovative, cutting edge solutions to our customers for the efficient post processing of 3D printed components”.
Besides the new partner in Sweden the international sales branches of the Rösler group are part of the global sales network. Therefore, AM Solutions has a presence in Belgium, Brazil, China, France, Great Britain, India, Italy, Netherlands, Austria, Rumania, Russia, Switzerland, Serbia, Spain and the United States. This global representation allows local as well as globally active companies to quickly implement 3D post processing solutions, tailormade to their needs and with a consistently high quality level.